Thermal simulation for multichip package.

Thermal and electro-thermal modeling and simulation techniques for multichip modules

Package Thermal Characterization

Effective heat removal from the IC chip, through the package, to the adjacent environment is crucial to maintain an allowable device junction temperature. The latter directly affects the electrical circuit performance both at the component and system levels. Aside from thermal enhancement of individual packages by the IC manufacturers, proper printed circuit board (PCB) layout and cabinet desig...

THERMUS - A thermal model package for ROOT

THERMUS is a package of C++ classes and functions allowing statistical-thermal model analyses of particle production in relativistic heavy-ion collisions to be performed within the ROOT framework of analysis. Calculations are possible within three statistical ensembles; a grand-canonical treatment of the conserved charges B, S and Q, a fully canonical treatment of the conserved charges, and a m...

Failure Analysis and Stress Simulation in Small Multichip BGAs

This paper examines one of the common modes of structural failure in multichip ball grid arrays (BGAs), determines its locations within the package structure, relates it to the stresses generated in the reliability tests under which it occurs, and by Finite Element simulations, determines an explanation for the failure, and finally proposes a method to avoid this failure mechanism. Several desi...

IBIsCO: A molecular dynamics simulation package for coarse-grained simulation

IBIsCO is a parallel molecular dynamics simulation package developed specially for coarse-grained simulations with numerical potentials derived by the iterative Boltzmann inversion (IBI) method (Reith et al., J Comput Chem 2003, 24, 1624). In addition to common features of molecular dynamics programs, the techniques of dissipative particle dynamics (Groot and Warren, J Chem Phys 1997, 107, 4423...